Wafer Packing Machine

Wafer Packing Machine

The Wafer Packing Machine is engineered with four high-precision servo systems and advanced intelligent photoelectric tracking technology, making it ideal for the individual packaging of wafer biscuits and related products such as soda crackers, cream-filled sandwiches and more. With over two decades of dedicated research and development in packaging machinery, our Wafer Packing Machine meets the most demanding requirements for stand-alone biscuit packaging with exceptional accuracy and consistency.

Product Introduction

 

The Wafer Packing Machine is engineered with four high-precision servo systems and advanced intelligent photoelectric tracking technology, making it ideal for the individual packaging of wafer biscuits and related products such as soda crackers, cream-filled sandwiches and more. With over two decades of dedicated research and development in packaging machinery, our Wafer Packing Machine meets the most demanding requirements for stand-alone biscuit packaging with exceptional accuracy and consistency.
It ensures precise positioning and neat sealing for each package, significantly reducing waste often caused by misalignment or irregular bag shapes. This high level of performance helps manufacturers maintain product quality while optimizing production efficiency.

 

Technical Parameters

 

Maximum product height 35 mm
Film width range 150–170 mm
Cutting length 80–140 mm
Max. packaging speed 150 packages/minute

Max. film roll diameter

320 mm

 

1

 

The above are the key technical specifications of the Wafer Packing Machine. If your requirements differ slightly from these parameters, please contact us promptly. Our technical department will strive to accommodate your needs.

 

Equipment Features

 

The Wafer Packing Machine is equipped with independent IPD intelligent temperature control modules for both the end-sealing and center-sealing components, offering unmatched flexibility. Operators can adjust the temperature for each sealing unit individually, enabling compatibility with a wide variety of materials-from standard PE films to high-barrier options such as aluminum composite films. This ensures excellent seal integrity and visual appeal while also extending the shelf life of the packaged products by effectively preventing moisture and oxidation.

 

Feeding Methods


To suit different production environments, the machine supports multiple feeding methods:

  1. Manual feeding
  2. Customizable automatic feeding

We work closely with clients to analyze their specific operational conditions and provide customized solutions along with detailed quotations.

 

Why Choose Us

 

At Weilong Packaging, we strongly emphasize transparent communication and collaborative planning to deliver solutions that meet your expectations while avoiding unnecessary costs. We highly value our reputation and are committed to building lasting relationships based on trust and performance.
Choosing our Wafer Packing Machine means more than acquiring advanced equipment-it means gaining a reliable and supportive partner in the Chinese market.

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